HIPS (High Impact Polystyrene), also known as PS (Polystyrene), is an amorphous thermoplastic material, used in lower heat applications. It is categorized as a standard material, and offers ease of processing, high impact strength, and stiffness.
More about High Impact Polystyrene (HIPS) »High impact strength
Can be printed using Digital, Screen, Flexo, and Litho inks
Fabricates well – can be guillotine cut, die-cut, punched and formed
Easy to Thermoform
Good dimensional stability
Fully recyclable with minimal loss of properties
FDA approved with 100% virgin resin
Technical Resources
- Primex – Print Material Processing Guide
- Primex – Print Material Application Guide
- Primex – IMPAX HIPS Data Sheets
- Primex SellSheet Classi Card
- Primex – DIGI HIPS
- Primex – Impax
- Primex SellSheet TearTuff
- Primex Flyer HIPS
- Primex Flyer Luminique
- Primex – Print Grade Materials
- Primex Flyer TEARTUF
- Primex Flyer CLASSI CARD
- Primex Flyer DIGI HIPS
- Primex DataSheet PI250
- Primex DataSheet PI450
- Primex DataSheet PI450D
- Primex DataSheet PI650D
- Primex DataSheet TEARTUF
- Primex DataSheet Classi Card
- Primex DataSheet Clear X 200
- Primex – DIGI HIPS Data Sheet
- Primex Brochure Print Grade
Suppliers / Brands
Common Applications
Physical Properties
Units | ASTM Test | High Impact Polystyrene | |
---|---|---|---|
Tensile strength @ break @ 73°F | psi | D638 | 2,480 – 4,520 psi |
Flexural modulus @ 73°F | psi | D790 | 193,000 – 381,000 psi |
Izod impact (notched) | ft-lbs/in of notch | D256 | 1.2 – 2.8 ft-lbs/in of notch |
Water absorption @ 73°F – 24 hours | % | D570 | 0.036 – 0.11% |
Coefficient of linear thermal expansion (CLTE) | (in/in F) | D696 | 5.0E-5 to 5.1E-5 (in/in/°F |
Heat deflection temp. @ 264 psi | 160° – 189° F (71° – 87° C) | D648 | 160° – 189° F (71° – 87° C) |
* Technical Data is provided courtesy of UL Prospector (www.ulprospector.com) and IAPD (www.IAPD.org).
Data is to be considered representative and is provided for guidance only. All product performance must be verified by the user under actual application conditions.